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Copyright © 2016 Semiconductor Enclosures, Inc
Milling & Tape Casting
• Alumina
• Alumina Silicates
• Zirconia Toughened Alumina
• Aluminum Nitride
Tape Punching
• Automated
• Varible Speed
Screen Printing
• Tungsten
• Molybdenum/Manganese
• Dielectrics
Lamination
• Multilayer
• Uniaxial
• Isostatic
• Semi Isostatic
Singulation
• Hot Knife
• Dicing
• Laser
• Gang Punching
Firing
• To 2100°C
• N2/ H2/ Inert/ Vacuum
• Pushing
• Periodic
• Refractory Metal
• Air Firing
Clean Room
Plating
• In-house Electroless Nickel Plated with Immersion Gold (E-NIG), Electroless Nickel Palladium and Gold (ENEPIG), along with Nickel, Gold, Silver, Copper and Tin
Tooling
• EDN
• CNC
• Fixture Fabrication
Inspection
• Optical CMM
• XRF
• Thermal Analysis
Sample Request