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Copyright © 2016 Semiconductor Enclosures, Inc
Overall Dimensions
Standard
Custom
1. Max Size (A x B):
2 x 2 [50.8 x 50.8]
3 x 3 [76.2 x 76.2]
2. Tolerance (As fired)
a) Overall (A & B):
b) Thickness (C & D):
c) Flatness:
±1%, NLT ±.005 [0.127]
±10%, NLT ±.002 [0.051]
0.004/ inch [.102/ mm]
±0.5%, NLT ±.003 [0.076]
±7%, NLT ±.002” [0.051]
0.003/ inch [.076/ mm]
3. Number of Layers (C):
a) Tape Layer
b) Overall Thickness
2
0.010 to 0.060 [0.250 to 1.50] Typ.
10
Up to 0.150 [4.00]
4. Cavity Depth
0.040 [1.00] Typ.
Up to 0.120 [3.00]
Via & Conductor Dimensions (Tape Layers):
NLT: Not Less Than
◊ = Greater Dimensions Available
Coated Via Hole Dimensions (Tape Layers):
Standard◊
Custom
A. Via Hole Diameter:
.010 [0.254]
.006 [0.152]
B. Via Cover Dot Diameter:
.020 [0.508]
.012 [0.305]
C. Via Center Spacing:
3x Ø
3x Ø
D. Via Center Spacing:
3x Ø
3x Ø
E. Via Center Spacing:
3x Ø
3x Ø
F. Via Cover Dot to Line Clearance:
.012 [0.305]
.008 [0.203]
G. Line Width:
.010 [0.254]
.005 [0.127]
H. Line to Line Clearance:
.010 [0.254]
.006 [0.152]
J. Line Center Spacing:
.020 [0.508]
.008 [0.203]
K. Cavity to Via Center:
3x Ø
2.5x Ø
L. Outside Edge to Via Center:
4x Ø
3x Ø
M. Line to Outside Edge:
.020 [0.508]
.015 [0.381]
Standard◊
Custom
A. Closed Hole Diameter:
.020 [0.508] Min.
.015 [0.381]
B. Via Cover Dot Diamater:
.020 [0.508] Min.
.014 [0.356]
C. Open Hole Diameter:
.020 [0.508] Min.
.015 [0.381]
D. Via Cover Dot Diameter:
.020 [0.508] Min.
.014 [0.356]
E. Opening Diameter:
.020 [0.508] Min.
.015 [0.381]
F. Castellation (Chip Carrier):
Ø.020 [0.254]
Ø.015 [0.381]
G. Castellation (Chip Carrier):
Ø.020 [0.254]
Ø.015 [0.381]
H. Solid Via Diameter:
Ø.006 - .015
[0.152 - 0.381] Typ.
◊ = Greater Dimensions Available
Dimensions in inches [mm]