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Multilayer Ceramic Package Capabilities
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Alumina & ZTA
AlN
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Copyright © 2016 Semiconductor Enclosures, Inc
Milling
Powder
Tape Casting
Tape Registration
Tape Punching
Via Punching/
Bore Coating
Via Filling
Conductor
Printing
Lamination
Final Blanking
Firing
Plating
Fixture Machining
Assembly
Brazing
Final Plating
Semiconductor Enclosures Incorporated (SEI) is a powder to package, fully integrated HTCC technical ceramics manufacturer located in Newburyport, Massachusetts. SEI provides ceramic tape systems, ceramic substrates, multilayer ceramic substrates, metallization services, metal to ceramic assemblies, and microelectronic ceramic packaging.

We specialize in multiple ceramics including:
• A variety of Aluminas (Al2O3)
Zirconia Toughened Alumina (ZTA)
Aluminum Nitride (AlN)

We can accept a simple print and most software formats for your prototype design. We are using Solidworks, DraftSight, Sonnet EM, ANSYS DesignSpace and CST Microwave Studio.

Below is a general overview of our multilayer ceramic process using an example design. Each device is manufactured using it's own process with our extensive in-house equipment capabilities for maximum efficiency. For more information on our vertically integrated process capabilities
click here.