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Tungsten
Bulk Modulus (GPa):
310
Shear Modulus (GPa):
161
Melting Point:
3410°C ±30ºC
Boiling Point:
5500ºC
CTE (x10^-6/°C):
4.5
Adhesion:
4.3K g/mm^2 (6,000 psi)
Solder Leach:
10 Cycles - No Degradation of Nickel Over Tungsten (30 Seconds Dipping Per Cycle in 60/40 @ 230°C)
Thermal Conductivity @25°C (W/mK):
150 - 160
Electrical Resistivity:
5.5 x 10-8Ω per cm
External Sheet Resistivity (plated):
5mΩ/square
Internal Sheet Resistivity:
10mΩ – 12mΩ/square
Plated Metallizations

SEI offers a variety of finishes including: ENEPIG, ENIG, Ni, Au, Ag, Cu and Pd.

These are offered with ASTM or MIL specs, however exact specifications are usually driven by the customer.