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Power AlN Packages
Power Package 1
Power Package 2
Power Package 3
Power Package 4
Power Package 5
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Copyright © 2016 Semiconductor Enclosures, Inc
Semiconductor Enclosures Inc. (SEI) offers AlN High Temperature Co-Fired Ceramic packaging technology for high current density applications.High current and high voltages can be accommodated in our simple, yet effective AlN ceramic with Tungsten metallization power packages.

High Temperature Co-Fired Ceramic (HTCC) multilayer AlN circuits fired at up to 2100°C is Co-Efficient of Thermal Expansion (CTE) matched with Tungsten metallization. This combination provides for excellent mechanical strength making it ideal for your high current ceramic package applications.

SEI can also provide multi-layer channelized High Temperature Co-Fired Ceramic (HTCC)  for active cooling by fluids or cryogenic gas.